Base Material
Adhesive Laminate
FR / LF
DuPont PI film bonded to copper foil on one or two sides with a dedicated flame-retardant acrylic adhesive.
Fine circuit fabrication.
Adhesiveless
AP / AC
DuPont PI film laminated directly with copper foil.
Thin, dense connector circuits and single-sided, double-sided or multilayer flexible circuit boards.
PI Coverlay
LF / FR
DuPont PI film with a flame-retardant acrylic adhesive on one side.
Protective layer in circuit board fabrication with insulation and solder-mask functions.
Bondply
LF / FR
Dedicated flame-retardant acrylic adhesive material.
Bonding flexible inner layers and rigid cover layers; rigid-flex and multilayer circuit board lamination.
Complete product specifications are available. For details, please call: +86 15895555913.
